5

FN7305.5

November 30, 2007

FIGURE 7. PSRR vs FREQUENCY

FIGURE 9. GROUP DELAY AS THE FUNCTION OF THE

FREQUENCY REPONSE CONTROL VOLTAGE

FIGURE 10. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE

0

-20

-40

-60

-80

-100

10

10k

10M

100M

FREQUENCY (Hz)

100

100k

1k

1M

INPUTS ON GND

10dB/DIV

1M

FREQUENCY (Hz)

10M

100M

100mV STEP

-20

-10

0

10

20

30

40

50

60

100mV STEP

1M

100M

FREQUENCY (Hz)

10M

200M

50

30

10

-10

-30

-50

10ns/DIV

791mW

θ

58°C

/W

QS

OP

16

1.4

1.2

1

0.8

0.6

0.2

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

125

85

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.4

1.116W

θ

12°

C/W

QS

OP

16

1.8

1.6

1

0.8

0.6

0.2

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

125

85

JEDEC JESD51-7 HIGH EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.4

1.4

1.2

EL9110