6

FN2810.9

April 25, 2007

Thermal Information

Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6.0V

ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1

Operating Conditions

Operating Voltage Range (Commercial, Industrial). . +4.75V to +5.25V

Operating Temperature Range (Commercial) . . . . . . . 0°C to +70°C

Operating Temperature Range (Industrial) . . . . . . . .-40°C to +85°C

Thermal Resistance (Typical, Note 1)

SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . .

70

Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C

Maximum Storage Temperature Range . . . . . . . . . . -65°C to +150°C

Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below

http://www.intersil.com/pbfree/Pb-FreeReflow.asp

Die Characteristics

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTE:

1.

θ

DC Electrical Specifications

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

MAX

UNITS

Logical One Input Voltage

2.0

-

V

Logical Zero Input Voltage

-

0.8

V

High Level Clock Input

3.0

-

V

Low Level Clock Input

-

0.8

V

Output HIGH Voltage

2.6

-

V

Output LOW Voltage

-

0.4

V

Input Leakage Current

-10

10

μA

Standby Power Supply Current

-

500

μA

Operating Power Supply Current

-99

mA

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

MAX

UNITS

Input Capacitance

measurements are referenced to device

ground

-10

pF

Output Capacitance

-10

pF

NOTES:

3. Not tested, but characterized at initial design and at major process/design changes.

HSP45102