FLL_RES = 62k

Ω, unless otherwise specified.)

Symbol

Parameter

Test Condition

Min.

Typ.

Max.

Unit

POWER SUPPLIES

12V Supply

10.8

13.2

V

SPINDLE + VCM

20

mA

SPINDLE ONLY

7

mA

VCM ONLY

12

mA

3.5

13.2

V

5V supply

4.5

5.5

V

5V supply

SPINDLE + VCM

6

mA

SPINDLE ONLY

7

mA

VCM ONLY

12

mA

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

Maximum Supply voltage

-0.5 to 14

V

Maximum Logic supply

-0.5 to 6

V

Maximum digital input voltage

V

Minimum digital input voltage

GND - 0.3V

V

Spindle peak sink/source output current

2.1

A

VCM peak sink/source output current

1.6

A

Maximum Total Power Dissipation

≈ 1.7

W

Maximum Storage/Junction Temperature

-40 to 150

°C

THERMAL DATA

Symbol

Parameter

Value

Unit

Thermal Resistance Junction to Case

≈ 20

°C/W

Thermal Resistance to Junction to ambient

≈ 40

≈ 25 with soldered slug

°C/W

°C/W

(*) In typical application with multilayer 120x120mm Printed Circuit Board.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Value

Unit

Supply voltage

10.8 to 13.2

V

Maximum Logic supply

4.5 to 5.5

V

Operating Ambient Temperature

0 to 70

°C

Junction Temperature

0 to 125

°C

L6254

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