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FPD1000AS Datasheet(PDF) 1 Page - Filtronic Compound Semiconductors

Part # FPD1000AS
Description  1W PACKAGED POWER PHEMT
Download  11 Pages
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Manufacturer  FILTRONIC [Filtronic Compound Semiconductors]
Direct Link  http://www.filtronic.co.uk/
Logo FILTRONIC - Filtronic Compound Semiconductors

FPD1000AS Datasheet(HTML) 1 Page - Filtronic Compound Semiconductors

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1W PACKAGED POWER PHEMT
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
1
Datasheet v3.0
FPD1000AS
FEATURES:
31 dBm Output Power (P1dB) @1.8GHz
15 dB Power Gain (G1dB) @ 1.8GHz
43 dBm Output IP3
-42 dBc WCDMA ACPR at 21 dBm PCH
10V Operation
50% Power-Added Efficiency
Evaluation Boards Available
Suitable for applications to 5 GHz
GENERAL DESCRIPTION:
The FPD1000AS is a packaged depletion
mode AlGaAs/InGaAs pseudomorphic High
Electron
Mobility
Transistor
(pHEMT),
optimized for power applications in L-Band.
The
surface-mount
package
has
been
optimized for low parasitics.
PACKAGE
YPICAL
APPLICATIONS:
in PCS/Cellular
T
Drivers or output stages
base station transmitter amplifiers
Power applications in WLL/WLAN and
WiMax amplifiers
ELECTRICAL SPECIFICATIONS:
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Power at 1dB Gain Compression
P1dB
VDS = 10V; IDS = 200 mA
ΓS and ΓL tuned for Optimum IP3
30
31
dBm
Power Gain at 1dB Gain Compression
G1dB
VDS = 10V; IDS = 200 mA
ΓS and ΓL tuned for Optimum IP3
13.5
15.0
Maximum Stable Gain
S21/S12
MSG
VDS = 10 V; IDS = 200mA
PIN = 0dBm, 50
Ω system
20
dB
Power-Added Efficiency
at 1dB Gain Compression
PAE
VDS = 10V; IDS = 200 mA
ΓS and ΓL tuned for Optimum IP3
50
%
3rd-Order Intermodulation Distortion
ΓS and ΓL tuned for Optimum IP3
IM3
VDS = 10V; IDS = 200 mA
POUT = 19 dBm (single-tone level)
-46
dBc
Saturated Drain-Source Current
IDSS
VDS = 1.3 V; VGS = 0 V
480
650
800
mA
Maximum Drain-Source Current
IMAX
VDS = 1.3 V; VGS
≅ +1 V
1100
mA
Transconductance
GM
VDS = 1.3 V; VGS = 0 V
720
mS
Gate-Source Leakage Current
IGSO
VGS = -3 V
20
50
µA
Pinch-Off Voltage
|VP|
VDS = 1.3 V; IDS = 2.4 mA
0.7
0.9
1.4
V
Gate-Source Breakdown Voltage
|VBDGS|
IGS = 2.4 mA
6
V
Gate-Drain Breakdown Voltage
|VBDGD|
IGD = 2.4 mA
20
V
Thermal Resistance (channel-to-case)
Θ
CC
See Note on following page
25
°C/W
Note: TAMBIENT = 22°; RF specification measured at f = 1850 MHz using CW signal (except as noted)


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