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RF3165 Datasheet(PDF) 4 Page - RF Micro Devices

Part # RF3165
Description  3V 1750MHZ W-CDMA LINEAR POWER AMPLIFIER MODULE
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Manufacturer  RFMD [RF Micro Devices]
Direct Link  http://www.rfmd.com
Logo RFMD - RF Micro Devices

RF3165 Datasheet(HTML) 4 Page - RF Micro Devices

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RF3165
Rev A7 DS061201
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Package Drawing
Pin
Function
Description
Interface Schematic
1RF IN
RF input internally matched to 50
Ω. This input is internally AC-coupled.
2GND
Ground connection.
3VMODE
For nominal operation (High Power mode), VMODE is set LOW. When set
HIGH, devices are biased lower to improve efficiency at lower output levels.
4VREG
Regulated voltage supply for amplifier bias circuit. In power down mode,
both VREG and VMODE need to be LOW (<0.5V).
5NC
No connection. Do not connect this pin to any external circuit.
6NC
No connection. Do not connect this pin to any external circuit.
7NC
No connection. Do not connect this pin to any external circuit.
8NC
No connection. Do not connect this pin to any external circuit.
9RF OUT
RF output. Internally AC-coupled.
10
VCC2
Output stage collector supply. Connect to pin 11 with the shortest trace
possible. Please see the schematic for required external components. See
note.
11
VCC2
Output stage collector supply and output matching. Connect to pin 10 and
pin 12 with the shortest trace possible. See note.
12
VCC2
Output stage collector supply and output matching. Connect to pin 11 with
the shortest trace possible. See note.
13
NC
No connection. Do not connect this pin to any external circuit.
14
IM
Interstage matching. Connect to pin 15 with the shortest trace possible.
See note.
15
VCC1/IM
First stage collector supply and interstage matching. A 4.7
μF decoupling
capacitor may be required. Connect to pin 14 with the shortest trace possi-
ble. See note.
16
VCCBIAS
Power supply input for the DC bias circuitry.
Pkg
Base
GND
Ground connection. The backside of the package should be soldered to a
top side ground pad which is connected to the ground plane with multiple
vias. The pad should have a short thermal path to the ground plane.
Note: Refer to Layout Recommendation Application Note and Application Schematic for additional information.
B
3.00
A
3.00
Pin 1 ID
2 PLCS
0.15 C
2 PLCS
0.15 C
0.203 REF
0.102 REF
0.08 C
C
0.08 C
0.925
0.775
1.45
0.05
0.28
0.18
TYP
Pin 1 ID
0.50 TYP
0.40
0.20
TYP
0.10
C AB
M
1.45
Shaded areas represent pin 1.
Dimensions in mm.


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