AD9787-EBZ datasheet(6/64 Pages) AD

Part #	AD9787-EBZ

Description	Dual 12-/14-/16-Bit 800 MSPS DAC with Low Power 32-Bit Complex NCO

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AD9785/AD9787/AD9788

Rev. 0 | Page 6 of 64

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

AVDD33 to AGND, DGND, CGND

−0.3 V to +3.6 V

DVDD33, DVDD18, CVDD18

to AGND, DGND, CGND

−0.3 V to +2.1 V

AGND to DGND, CGND

−0.3 V to +0.3 V

DGND to AGND, CGND

−0.3 V to +0.3 V

CGND to AGND, DGND

−0.3 V to +0.3 V

I120, VREF, IPTAT to AGND

−0.3 V to AVDD33 + 0.3 V

OUT1_P, OUT1_N, OUT2_P, OUT2_N,

AUX1_P, AUX1_N, AUX2_P,

AUX2_N to AGND

−1.0 V to AVDD33 + 0.3 V

P1D[15] to P1D[0], P2D[15] to P2D[0]

to DGND

−0.3 V to DVDD33 + 0.3 V

DATACLK, TXENABLE to DGND

−0.3 V to DVDD33 + 0.3 V

REFCLK+, REFCLK−, RESET, IRQ,

PLL_LOCK, SYNC_O+, SYNC_O−,

SYNC_I+, SYNC_I− to CGND

−0.3 V to CVDD18 + 0.3 V

RESET, IRQ, PLL_LOCK, SYNC_O+,

SYNC_O−, SYNC_I+, SYNC_I−,

SPI_CSB, SCLK, SPI_SDIO, SPI_SDO

to DGND

−0.3 V to DVDD33 + 0.3 V

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

For this 100-lead, thermally enhanced TQFP, the exposed paddle

(EPAD) must be soldered to the ground plane. Note that these

specifications are valid with no airflow movement.

Table 5. Thermal Resistance

Resistance

Unit

Conditions

θJA

19.1°C/W

EPAD soldered. No airflow.

θJB

12.4°C/W

EPAD soldered. No airflow.

θJC

7.1°C/W

EPAD soldered. No airflow.

ESD CAUTION

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