US90A / US91A

24V Hall IC Fan Driver

390109026302

Page 8 of 12

Data Sheet

Rev 002

Apr/07

14 Standard information regarding manufacturability of Melexis

products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity

level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

•

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

(classification reflow profiles according to table 5-2)

•

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

•

Melexis Working Instruction 341901308

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat

•

EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

•

Melexis Working Instruction 341901309

Iron Soldering THD’s (Through Hole Devices)

•

EN60749-15

Resistance to soldering temperature for through-hole mounted devices

•

Melexis Working Instruction 341901309

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

•

Melexis Working Instruction 3304312

For all soldering technologies deviating from above mentioned standard conditions (regarding peak

temperature, temperature gradient, temperature profile etc) additional classification and qualification tests

have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of

adhesive strength between device and board.

For more information on the lead free topic please see quality page at our website:

http://www.melexis.com/quality.aspx

15 ESD Precautions

Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).

Always observe Electro Static Discharge control procedures whenever handling semiconductor products.