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SGM8052XS Datasheet(PDF) 3 Page - SG Micro Corp |
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SGM8052XS Datasheet(HTML) 3 Page - SG Micro Corp |
3 / 20 page SGM8051/2/3/4/5 3 PACKAGE/ORDERING INFORMATION MODEL CHANNEL ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM8051XN5/TR SOT23-5 Tape and Reel, 3000 8051 SGM8051 Single SGM8051XS/TR SO-8 Tape and Reel, 2500 SGM8051XS SGM8052XMS/TR MSOP-8 Tape and Reel, 3000 SGM8052XMS SGM8052 Dual SGM8052XS/TR SO-8 Tape and Reel, 2500 SGM8052XS SGM8053XN6/TR SOT23-6 Tape and Reel, 3000 8053 SGM8053 Single with shutdown SGM8053XS/TR SO-8 Tape and Reel, 2500 SGM8053XS SGM8054XS14 SO-14 Tube, 50 SGM8054XS14 SGM8054XTS14 TSSOP-14 Tape and Reel, 3000 SGM8054XTS14 SGM8054XS/TR SO-16 Tape and Reel, 2500 SGM8054XS SGM8054 Quad SGM8054XTS TSSOP-16 Tape and Reel, 3000 SGM8054XTS SGM8055 Dual with shutdown SGM8055XMS/TR MSOP-10 Tape and Reel, 3000 SGM8055XMS ABSOLUTE MAXIMUM RATINGS Supply Voltage, V+ to V- ......................................... 7.5 V Common-Mode Input Voltage ........................................ (–VS )– 0.5 V to (+VS) +0.5V Storage Temperature Range ................ –65℃ to +150℃ Junction Temperature ..............................................................160℃ Operating Temperature Range ........... –55℃ to +150℃ Package Thermal Resistance @ TA = 25℃ SOT23-5, θJA......................................................... 190 /W ℃ SOT23-6, θJA......................................................... 190 /W ℃ SO-8, θJA..................................................................125 /W ℃ MSOP-8, θJA.......................................................... 216 /W ℃ MSOP-10, θJA........................................................ 216 /W ℃ SO-16, θJA................................................................ 82 /W ℃ TSSOP-16, θJA....................................................... 105 /W ℃ Lead Temperature Range (Soldering 10 sec) ......................................... 260℃ ESD Susceptibility HBM...........................................................................1000V MM...............................................................................400V NOTES 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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