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SGM8633 Datasheet(PDF) 3 Page - SG Micro Corp |
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SGM8633 Datasheet(HTML) 3 Page - SG Micro Corp |
3 / 18 page SGM8631/2/3/4 3 PACKAGE/ORDERING INFORMATION MODEL ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM8631XC5/TR SC70-5 Tape and Reel, 3000 8631 SGM8631XN5/TR SOT23-5 Tape and Reel, 3000 8631 SGM8631 SGM8631XS/TR SO-8 Tape and Reel, 2500 SGM8631XS SGM8632XMS/TR MSOP-8 Tape and Reel, 3000 SGM8632XMS SGM8632 SGM8632XS/TR SO-8 Tape and Reel, 2500 SGM8632XS SGM8633XN6/TR SOT23-6 Tape and Reel, 3000 8633 SGM8633 SGM8633XS/TR SO-8 Tape and Reel, 2500 SGM8633XS SGM8634XS/TR SO-16 Tape and Reel, 2500 SGM8634XS SGM8634 SGM8634XTS TSSOP-16 Tape and Reel, 3000 SGM8634XTS ABSOLUTE MAXIMUM RATINGS Supply Voltage, V+ to V- . ........................................... 7.5 V Common-Mode Input Voltage .................................... (–VS) – 0.5 V to (+VS) +0.5V Storage Temperature Range ..................... –65℃ to +150℃ Junction Temperature .................................................160℃ Operating Temperature Range .................–55℃ to +150℃ Package Thermal Resistance @ TA = 25℃ SC70-5, θJA............................ .................................... 333 /W ℃ SOT23-5, θJA........................ ...................................... 190 /W ℃ SOT23-6, θJA.......... .................................................... 190 /W ℃ SO-8, θJA............................. .........................................125 /W ℃ MSOP-8, θJA.............. ................................................ 216 /W ℃ SO-16, θJA................... .................................................. 82 /W ℃ TSSOP-16, θJA................ ............................................ 105 /W ℃ Lead Temperature Range (Soldering 10 sec) .....................................................260℃ ESD Susceptibility HBM............................................ ....................................1500V MM............................... .....................................................400V NOTES 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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Similar Description - SGM8633 |
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