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SGM8544 Datasheet(PDF) 3 Page - SG Micro Corp |
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SGM8544 Datasheet(HTML) 3 Page - SG Micro Corp |
3 / 14 page SGM8541/8542/8544 3 PACKAGE/ORDERING INFORMATION MODEL ORDER NUMBER PACKAGE DESCRIPTION PACKAGE OPTION MARKING INFORMATION SGM8541XN5/TR SOT23-5 Tape and Reel, 3000 8541 SGM8541 SGM8541XS/TR SO-8 Tape and Reel, 2500 SGM8541XS SGM8542XS/TR SO-8 Tape and Reel, 2500 SGM8542XS SGM8542 SGM8542XMS/TR MSOP-8 Tape and Reel, 3000 SGM8542XMS SGM8544XS/TR SO-16 Tape and Reel, 2500 SGM8544XS SGM8544 SGM8544XTS TSSOP-16 Tape and Reel, 3000 SGM8544XTS ABSOLUTE MAXIMUM RATINGS Supply Voltage, V+ to V- ........................................... 7.5 V Common-Mode Input Voltage ..................... ......................(–VS )– 0.5 V to (+VS) +0.5V Storage Temperature Range.................. –65℃ to +150℃ Junction Temperature ............................................... 150℃ Operating Temperature Range ........... –55℃ to +150℃ Package Thermal Resistance @ TA = 25℃ SOT23-5, θJA........................ ...................................... 190 /W ℃ SO-8, θJA............................. .........................................125 /W ℃ MSOP-8, θJA.............. ................................................ 216 /W ℃ SO-16, θJA................... .................................................. 82 /W ℃ TSSOP-16, θJA................ ............................................ 105 /W ℃ Lead Temperature Range (Soldering 10 sec) .....................................................260℃ ESD Susceptibility HBM............................................ ....................................4000V MM............................... .....................................................400V NOTES 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. CAUTION This integrated circuit can be damaged by ESD. Shengbang Micro-electronics recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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