SGM8051/2/3/4/5

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PACKAGE/ORDERING INFORMATION

MODEL

CHANNEL

ORDER NUMBER

PACKAGE

DESCRIPTION

PACKAGE

OPTION

MARKING

INFORMATION

SGM8051XN5/TR

SOT23-5

Tape and Reel, 3000

8051

SGM8051

Single

SGM8051XS/TR

SO-8

Tape and Reel, 2500

SGM8051XS

SGM8052XMS/TR

MSOP-8

Tape and Reel, 3000

SGM8052XMS

SGM8052

Dual

SGM8052XS/TR

SO-8

Tape and Reel, 2500

SGM8052XS

SGM8053XN6/TR

SOT23-6

Tape and Reel, 3000

8053

SGM8053

Single

with shutdown

SGM8053XS/TR

SO-8

Tape and Reel, 2500

SGM8053XS

SGM8054XS14

SO-14

Tube, 50

SGM8054XS14

SGM8054XTS14

TSSOP-14

Tape and Reel, 3000

SGM8054XTS14

SGM8054XS/TR

SO-16

Tape and Reel, 2500

SGM8054XS

SGM8054

Quad

SGM8054XTS

TSSOP-16

Tape and Reel, 3000

SGM8054XTS

SGM8055

Dual

with shutdown

SGM8055XMS/TR

MSOP-10

Tape and Reel, 3000

SGM8055XMS

ABSOLUTE MAXIMUM RATINGS

Supply Voltage, V+ to V- ......................................... 7.5 V

Common-Mode Input Voltage

Storage Temperature Range ................ –65℃ to +150℃

Junction

Temperature ..............................................................160℃

Operating Temperature Range ........... –55℃ to +150℃

℃

℃

SO-8,

℃

℃

℃

℃

℃

Lead Temperature Range (Soldering 10 sec)

......................................... 260℃

ESD Susceptibility

HBM...........................................................................1000V

MM...............................................................................400V

NOTES

1.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD.

Shengbang Micro-electronics recommends that all

integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and

installation procedures can cause damage.

ESD damage can range from subtle performance

degradation to complete device failure. Precision

integrated circuits may be more susceptible to

damage because very small parametric changes

could cause the device not to meet its published

specifications.