DA5534B_003.doc

February 28th, 2005

20

00005534B784

ECN 711

CLEANING

The MS5534B has been manufactured under cleanroom conditions. Each device has been inspected for the

homogeneity and the cleanness of the silicone gel. It is therefore recommended to assemble the sensor under

class 10’000 or better conditions. Should this not be possible, it is recommended to protect the sensor opening

during assembly from entering particles and dust. To avoid cleaning of the PCB, solder paste of type “no-clean”

ESD PRECAUTIONS

The electrical contacts except programming pads are protected against ESD according to 2 kV HBM (human body

model). The PV programming pad is more sensitive due to the nature of the OTP programming cells that store the

calibration coefficients. The breakdown voltage of PV is 1 kV. It is therefore essential to ground machines and

personal properly during assembly and handling of the device. The MS5534B is shipped in antistatic transport

boxes. Any test adapters or production transport boxes used during the assembly of the sensor shall be of an

equivalent antistatic material.