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ST14C02C Datasheet(PDF) 10 Page - STMicroelectronics |
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ST14C02C Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 13 page 2.2min 2.54 4.75 9.5 1.422 R0.15 5.2 ±0.2 (P)ø2.2 (M)ø1.5 7 max 0.16 0.58 max 0.1 DIE SIDE CROSS SECTION CONTACT SIDE Copyright SGS-THOMSON Microelectronics. Unauthorized reproduction and communication is stricly GRAPHIC TITLE: GRAPHICS REV. SCALE CONTROLED BY: DRAWN BY: DATUM Z.I. de Rousset Fax (33) 42.53.22.88 Tel. (33) 42.25.88.00 B.P. 2 - 13106 ROUSSET CEDEX POA FOR MICROMODULE D15 06/1998 ROYER.G STEFFEN.F none A NOTE: - (P) is reject identification hole ø2.2 - (M) may be punched with (P): center positioning ±0.2 - Sproket holes may be with or without metalisation - Recommended punching contour for the customer: 8.32*11 R1.4 - Minimal contact area according to ISO 7816-1 GENERAL TOLERANCE IS ±0.1 mm ALL DIMENSIONS ARE IN MILLIMETERS Measurements are subject to change without notice PACKAGE CODE FU 8.12 R1.3 |
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