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XF2H-3815-1 Datasheet(PDF) 5 Page - Omron Electronics LLC |
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XF2H-3815-1 Datasheet(HTML) 5 Page - Omron Electronics LLC |
5 / 6 page XF2H XF2H 5 Precautions J RECOMMENDED REFLOW CONDITIONS Pre-heat Temperature: 150±10°C Time: 60 to 120 seconds Soldering Temperature: 200 to 240°C Time: Not exceeding 30 seconds (Not exceeding 10 seconds at 240°C maximum temperature.) J STORAGE Do not store under high humidity levels as this may cause deterioration of the insulation. J HANDLING THE FPC Do not forcibly bend or pull an FPC which has been mounted and locked. This may cause discontinuities in the FPC. |
Similar Part No. - XF2H-3815-1 |
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Similar Description - XF2H-3815-1 |
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