3

3 - 5

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

RF / IF Input

+13 dBm

LO Drive

+27 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 9.36 mW/°C above 85 °C)

0.61 W

Thermal Resistance (R

TH

)

(junction to die bottom)

106.8 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. BOND PADS ARE .004” SQUARE.

3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”.

4. BACKSIDE METALLIZATION: GOLD.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Standard

Alternate

WP-3

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

HMC256

v03.1007

GaAs MMIC I/Q MIXER

5.9 - 12 GHz