B1S THRU B10S

Features

Mechanical Data

· Glass Passivated Die Construction

· Diffused Junction

· Low Forward Voltage Drop, High Current Capability

· Surge Overload Rating to 30A Peak

· Designed for Printed Circuit Board Applications

· Plastic Material - UL Flammability Classification 94V-0

Maximum Ratings And Electrical Characteristics

· Case : Molded Plastic

· Terminals : Solder Plated Leads,

Solderable per MIL-STD-202, Method 2026

· Polarity : As Marked on Case

· Approx. Weight : 0.125 grams

· Mounting Position : Any

· Marking : Type Number

(Ratings at 25

℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive

load. For capacitive load, derate by 20%)

CURRENT 0.8 Amperes

VOLTAGE 100 to 1000 Volts

Notes:

(1) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC.

Peak Repetitive Reverse voltage

Working Peak Reverse voltage

DC Blocking voltage

RMS Reverse voltage

Average Rectified Output Current

Non-Repetitive Peak Forward Surge Current,

8.3ms single half-sine-wave superimposed

on rated load (JEDEC method)

Volts

Forward voltage (per element)

100

Volts

Symbols

Units

1.0

0.8

Amp

30

500

-55 to +150

℃

Amp

Peak Reverse Current at Rated

DC Blocking voltage (per element)

Typical Junction Capacitance

per element (Note 1)

Operating and Storage Temperature Range

B1S

B2S

B4S

B6S

B8S

B10S

70

10

10

200

400

140

280

600

420

800

560

1000

700

Volts

μA

℃/W

pF

Io

R

℃

℃

Typical Thermal Resistance,

Junction to Ambient (Note 2)

75

℃

A B

C

D E

G

H

J

L

K

MiniDIP

Dim

Min

Max

A

5.43

5.75

B

3.60

4.00

C

0.15

0.05

0.35

D

0.20

7.00

E

G

0.70

1.10

H

4.50

4.90

J

2.80

2.90

K

2.50

2.70

L

0.50

0.80

A ll Dimens ions in mm