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OPA452 Datasheet(PDF) 5 Page - Texas Instruments |
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OPA452 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 36 page  www.ti.com R L 50kW 100V PP 10kHz +50V E/DCom E/D -50V V OUT OPA454 SBOS391 – DECEMBER 2007 ELECTRICAL CHARACTERISTICS: VS = ±50V (continued) Boldface limits apply over the specified temperature range, TA = –40°C to +85°C. At TP = +25°C, RL = 4.8kΩ to mid-supply, VCM = VOUT = mid-supply, unless otherwise noted. OPA454 PARAMETER CONDITIONS MIN TYP MAX UNIT E/D (ENABLE/DISABLE) PIN E/D Pin, Referenced to E/D Com Pin(14)(15) High (output enabled) VSD Pin Open or Forced High E/D Com + 2.5 E/D Com + 5 V E/D Com + Low (output disabled) VSD Pin Forced Low E/D Com V 0.65 Output Disable Time 4 µs Output Enable Time 3 µs E/D COM PIN Voltage Range (V–) (V+) – 5 V POWER SUPPLY Specified Range VS ±50 V Operating Voltage Range ±5 ±50 V Quiescent Current IQ IO = 0 3.2 4 mA Quiescent Current in Shutdown Mode IO = 0, VE/D = 0.65V 150 210 µA TEMPERATURE RANGE Specified Range TA –40 +85 °C Operating Range TA –55 +125 °C Thermal Resistance, Junction-to-Case(16) SO-8 PowerPAD(17) θ JC 10 °C/W HSOP-20 10 °C/W Thermal Resistance, Junction-to-Ambient θ JA SO-8 PowerPAD(17) 24/52 °C/W HSOP-20(18) 65 °C/W (14) See typical characteristic curve, IENABLE vs VENABLE (Figure 46). (15) High enables the outputs. (16) TP is the temperature of the leadframe die pad (exposed thermal pad) of the PowerPAD package. (17) Lower value is for land area of 1-inch × 1-inch, 2-oz copper. Upper value is for exposed-pad sized area of 1-oz copper. (18) Value given is for DW-20 package, similar to the DWD package, but without an exposed pad. Actual θ JA may approach θJC by selection of external heatsink and airflow. Figure 1. Feedthrough Capacitance Circuit Copyright © 2007, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): OPA454 |
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