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LAP47B-T2V1-24-1 Datasheet(PDF) 10 Page - OSRAM GmbH |
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LAP47B-T2V1-24-1 Datasheet(HTML) 10 Page - OSRAM GmbH |
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10 / 16 page  2006-07-20 10 LA P47B, LY P47B Empfohlenes Lötpaddesign 8) Seite 16 IR Reflow Löten Recommended Solder Pad 8) page 16 IR Reflow Soldering Empfohlenes Lötpaddesign 8) Seite 16 IR Reflow Löten, montage von oben Recommended Solder Pad 8) page 16 IR Reflow Soldering, top mount OHAY1307 Hole in PCB Solder resist Lötstoplack (ø2.1 (0.083) 2.6 (0.102) 3.6 (0.142) (0.5 (0.020)) +0.1 (0.004) Padgeometrie für verbesserte Wärmeableitung Paddesign for improved heat dissipation Bauteil positioniert, Rückseite Component location on pad, backside ) OHAY2629 Lötstoplack Solder resist ø2.3 (0.091) 2.6 (0.102) 0.7 (0.028) No solder resist; no copper pad Kein Lötstoplack; kein Kupfer |
Similar Part No. - LAP47B-T2V1-24-1 |
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Similar Description - LAP47B-T2V1-24-1 |
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