SFH 9210

2005-02-18

9

Bitte Verarbeitungshinweise für SMT-Bauelemente beachten!

Please observe the handling guidelines for SMT devices!

Lötbedingungen

Vorbehandlung nach JEDEC Level 4

Soldering Conditions

Preconditioning acc. to JEDEC Level 4

IR-Reflow Lötprofil für bleifreies Löten

(nach J-STD-020B)

IR Reflow Soldering Profile for lead free soldering

(acc. to J-STD-020B)

Löthinweise

Soldering Conditions

Bauform

Type

Drypack

Level acc.

to

IPS-stand.

020

Tauch-, Schwalllötung

Dip, Wave Soldering

Reflowlötung

Reflow Soldering

Kolbenlötung

Iron Soldering

Peak Temp.

(solderbath)

Max. Time in

Peak Zone

Peak Temp.

(package

temp.)

Max. Time

in Peak

Zone

(Iron temp.)

SFH 9210

4

n. a.

–

260

°C

20 sec.

n.a.

OHLA0687

0

0

T

t

˚C

s

120 s max

50

100

150

200

250

300

Ramp Up

100 s max

50

100

150

200

250

300

Ramp Down

6 K/s (max)

3 K/s (max)

25 ˚C

30 s max

260 ˚C

+0 ˚C

-5 ˚C

240 ˚C

255 ˚C

217 ˚C

Maximum Solder Profile

Recommended Solder Profile

+5 ˚C

Minimum Solder Profile

10 s min