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SFH320 Datasheet(PDF) 7 Page - OSRAM GmbH

Part # SFH320
Description  NPN-Silizium-Fototransistor im SMT TOPLED
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Manufacturer  OSRAM [OSRAM GmbH]
Direct Link  http://www.osram.com
Logo OSRAM - OSRAM GmbH

SFH320 Datasheet(HTML) 7 Page - OSRAM GmbH

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SFH 320, SFH 320 FA
2001-02-22
7
Zusätzliche Informationen über allgemeine Lötbedingungen erhalten Sie auf Anfrage.
For additional information on general soldering conditions please contact us.
Published by OSRAM Opto Semiconductors GmbH & Co. OHG
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Löthinweise
Soldering Conditions
Bauform
Types
Tauch-, Schwall- und Schlepplötung
Dip, Wave and Drag Soldering
Reflowlötung
Reflow Soldering
Lötbad-
temperatur
Temperature
of the
Soldering
Bath
Maximal
zulässige
Lötzeit
Max. Perm.
Soldering
Time
Abstand
Lötstelle –
Gehäuse
Distance
between
Solder Joint
and Case
Lötzonen-
temperatur
Temperature
of Soldering
Zone
Maximale
Durchlaufzeit
Max. Transit
Time
TOPLED
260
°C
10 s
245
°C10 s


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