H04-004-03a

MS5F6012

13

5

L

Vcc

Ic

Ic

0V

0A

0V

10%

90%

10%

10%

90%

90%

0V

Ic

o n

t

r

t

r ( i )

t

o f f

t

f

t

r r

I

r r

t

Logo of production

Lot.No.

Place of manufacturing (code)

•

•

•

•

•

•

9. Definitions of switching time

Store modules with unprocessed terminals.

- Products quantity in a packing box

10. Packing and Labeling

Display on the packing box

- Logo of production

- Type name

- Lot No

Do not drop or otherwise shock the modules when transporting.

7. Applicable category

This specification is applied to IGBT-Module named 6MBI100U4B-120.

module surface.

8. Storage and transportation notes

The module should be stored at a standard temperature of 5 to 35

Store modules in a place with few temperature changes in order to avoid condensation on the

Avoid exposure to corrosive gases and dust.

Avoid excessive external force on the module.

Rth(j-c)

0.05

Thermal resistance(1device)

IGBT

-

-

-

5. Thermal resistance characteristics

Items

Symbols

Conditions

Units

min.

typ.

max.

Characteristics

0.24

FWD

-

-

6MBI100U4B-120

100A 1200V

Contact Thermal resistance

(1 device) (*5)

Rth(c-f)

with Thermal Compound

(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.

6. Indication on module

-

0.39