H04-004-03a

MS5F6037

13

5

L

V cc

Ic

Ic

0V

0A

0V

10%

90%

10%

10%

90%

90%

0V

Ic

o n

t

r

t

r ( i )

t

o f f

t

f

t

r r

I

r r

t

Logo of production

Lot.No.

Place of manufacturing (code)

•

•

•

•

•

•

2MBI300U4H-120

300A 1200V

Contact Thermal resistance

(1 device) (*5)

Rth(c-f)

with Thermal Compound

(*5) This is the value which is defined mounting on the additional cooling fin with thermal compound.

6. Indication on module

-

0.14

0.085

FWD

-

-

5. Thermal resistance characteristics

Items

Symbols

Conditions

Units

min.

typ.

max.

Characteristics

Rth(j-c)

0.0125

Thermal resistance(1device)

IGBT

-

-

-

Do not drop or otherwise shock the modules when transporting.

7. Applicable category

This specification is applied to IGBT-Module named 2MBI300U4H-120.

module surface.

8. Storage and transportation notes

The module should be stored at a standard temperature of 5 to 35

Store modules in a place with few temperature changes in order to avoid condensation on the

Avoid exposure to corrosive gases and dust.

Avoid excessive external force on the module.

Display on the packing box

- Logo of production

- Type name

- Lot No

9. Definitions of switching time

Store modules with unprocessed terminals.

- Products quantity in a packing box

10. Packing and Labeling