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UPC277MP5-KAA-E2-A Datasheet(PDF) 11 Page - NEC |
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UPC277MP5-KAA-E2-A Datasheet(HTML) 11 Page - NEC |
11 / 12 page Data Sheet G17934EJ3V0DS 11 μPC277GR-9LG, μPC277MP-KAA, μPC393GR-9LG RECOMMENDED SOLDERING CONDITIONS The μ PC277GR-9LG, μ PC277MP-KAA, μ PC393GR-9LG should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device μ PC277GR-9LG-A Note, μPC277GR(5)-9LG-A Note, μ PC393GR-9LG-A Note, μPC393GR(5)-9LG-A Note: 8-pin plastic TSSOP (5.72 mm (225)) μ PC277MP-KAA-A Note, μPC277MP(5)-KAA-A Note: 8-pin plastic TSSOP (2.8 x 2.9) Process Conditions Symbol Infrared ray reflow Peak temperature: 260 °C, Reflow time: 60 seconds or less (at 220°C or higher), Maximum number of reflow processes: 3 times. IR60-00-3 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). WS60-00-1 Partial heating method Pin temperature: 350 °C or below, Heat time: 3 seconds or less (Per each side of the device). P350 Note Pb-free (This product does not contain Pb in external electrode and other parts.) Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Remark Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended. REFERENCE DOCUMENTS Document Name Document No. QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES C11531E SEMICONDUCTOR DEVICE MOUNT MANUAL http://www.necel.com/pkg/en/mount/index.html NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL SYSTEM-STANDARD LINEAR IC IEI-1212 REVIEW OF QUALITY AND RELIABILITY HANDBOOK C12769E NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL SYSTEM C10983E <R> <R> |
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