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TA84007FG Datasheet(PDF) 1 Page - Toshiba Semiconductor

Part # TA84007FG
Description  DC Motor Full Bridge Driver ICs (Forward/reverse switching driver ICs)
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TA84007FG Datasheet(HTML) 1 Page - Toshiba Semiconductor

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TA84007PQ/SG/FG
2006-3-6
1
TOSHIBA Bipolar Linear Integrated Circuit
Silicon Monolithic
TA84007PQ,TA84007SG,TA84007FG
DC Motor Full Bridge Driver ICs (Forward/reverse switching driver ICs)
The TA84007PQ, TA84007SG and TA84007FG are bridge driver
ICs designed for forward/reverse rotation switching and that are
capable of four modes of control (forward, reverse, stop and
brake).
The TA84007PQ has an output current of 1.0 A (AVE.) and 2.0 A
(PEAK) and the TA84007SG and TA84007FG have an output
current of 0.4 A (AVE.) and 1.2 A (PEAK).
These driver ICs are equipped with a dual power supply pin on
the output and control sides and a Vref pin on the output side
capable of controlling motor voltage making it possible to adjust
the voltage applied to the motor. Additionally, these driver ICs
have a low input current and can connect directly to the CMOS.
Features
• Operation power supply voltage range:
VCC (opr.) = 4.5 to 27 V
VS (opr.) = 4.5 to 27 V
Vref (opr.) = 4.5 to 27 V
Usage Note:
Design your application so that Vref ≤ VS
• Output current: PQ: 1.0 A (AVE.), 2.0 A (PEAK)
SG and FG: 0.4 A (AVE.), 1.2 A (PEAK)
• Built-in thermal shutdown and overcurrent protection
• Built-in back EMF suppression diode
• Built-in input hysteresis
• Built-in standby
Note: These ICs are highly sensitive to electrostatic discharge.
When handling them, please be careful of electrostatic
discharge, temperature and humidity conditions.
TA84007PQ
TA84007SG
TA84007FG
Weight
HSIP10-P-2.54: 2.47 g (typ.)
SOIP9-P-2.54A: 0.92 g (typ.)
HSOP16-P-300-1.00: 0.50 g (typ.)
Preliminary
The following conditions apply to solderability:
*Solderability
1. Use of Sn-37Pb solder bath
*solder bath temperature = 230ºC
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245ºC
*dipping time = 5 seconds
*number of times = once
*use of R-type flux


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