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TLP371_07 Datasheet(PDF) 2 Page - Toshiba Semiconductor

Part No. TLP371_07
Description  GaAs Ired & Photo−Transistor
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Maker  TOSHIBA [Toshiba Semiconductor]
Homepage  http://www.semicon.toshiba.co.jp/eng
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 2 page
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TLP371,TLP372
2007-10-01
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
IF
60
mA
Forward current derating (Ta ≥ 39°C)
ΔIF / °C
−0.7
mA / °C
Peak forward current (100μs pulse, 100pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Collector
−emitter voltage
VCEO
300
V
Collector
−base voltage (TLP371)
VCBO
300
V
Emitter
−collector voltage
VECO
0.3
V
Emitter
−base voltage (TLP371)
VEBO
7
V
Collector current
IC
150
mA
Power dissipation
PC
300
mW
Power dissipation derating (Ta ≥ 25°C)
ΔPC / °C
−3.0
mW / °C
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
−55~125
°C
Operating temperature range
Topr
−55~100
°C
Lead soldering temperature (10 s)
Tsold
260
°C
Total package power dissipation
PT
350
mW
Total package power dissipation derating (Ta ≥ 25°C)
ΔPT / °C
−3.5
mW / °C
Isolation voltage (AC, 1min., R.H. ≤ 60%)
(Note 1)
BVS
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Device considered a two terminal device: Pins 1, 2 and 3 shorted together and pins 4,5 and 6 shorted
together.
Recommended Operating Conditions
Characteristic
Symbol
Min
Typ.
Max
Unit
Supply voltage
VCC
200
V
Forward current
IF
16
25
mA
Collector current
IC
120
mA
Operating temperature
Topr
−25
85
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.




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