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AON3814 Datasheet(PDF) 2 Page - Alpha & Omega Semiconductors |
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AON3814 Datasheet(HTML) 2 Page - Alpha & Omega Semiconductors |
2 / 4 page AON3814 Symbol Min Typ Max Units BVDSS 20 V 1 TJ=55°C 5 IGSS 10 µA BVGSO ±12 V VGS(th) 0.4 0.71 1.1 V ID(ON) 30 A 11 14 17 TJ=125°C 15 19 24 11.5 15 18.5 m Ω 14.5 19 24 23 30 39 m Ω gFS 25 S VSD 0.75 1 V IS 3.5 A Ciss 1315 pF Coss 219 pF Crss 183 pF Rg 2.1 k Ω Qg 13.1 nC Qgs 6.7 nC Qgd 4.6 nC tD(on) 1 µs tr 2.8 µs tD(off) 5.6 µs tf 5.9 µs THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Maximum Body-Diode Continuous Current Input Capacitance Output Capacitance Gate-Source Breakdown Voltage VDS=0V, IG=±250µA VGS=2.5V, ID=6A Turn-On DelayTime DYNAMIC PARAMETERS VGS=0V, VDS=10V, f=1MHz Gate Drain Charge Reverse Transfer Capacitance Turn-On Rise Time Turn-Off DelayTime VGS=5V, VDS=10V, RL=1.7Ω, RGEN=3Ω Gate resistance VGS=0V, VDS=0V, f=1MHz Turn-Off Fall Time SWITCHING PARAMETERS Total Gate Charge VGS=4.5V, VDS=10V, ID=6A Gate Source Charge m Ω VGS=1.8V, ID=6A IS=1A,VGS=0V VDS=5V, ID=6A VGS=4V, ID=6A VGS=4.5V, ID=6A RDS(ON) Static Drain-Source On-Resistance Forward Transconductance Diode Forward Voltage Electrical Characteristics (TJ=25°C unless otherwise noted) STATIC PARAMETERS Parameter Conditions IDSS µA Gate Threshold Voltage VDS=VGS ID=250µA Drain-Source Breakdown Voltage On state drain current ID=250µA, VGS=0V VGS=4.5V, VDS=5V VDS=20V, VGS=0V Zero Gate Voltage Drain Current VDS=0V, VGS=±10V Gate-Body leakage current A: The value of RθJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The value in any given application depends on the user's specific board design. B: Repetitive rating, pulse width limited by junction temperature. C. The R θJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient. D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max. E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA curve provides a single pulse rating. F. The power dissipation and current rating is based on the t ≤ 10s thermal resistance, and current rating is also limited by wire-bonding. Rev 2:Sep 2007 Alpha & Omega Semiconductor, Ltd. www.aosmd.com |
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