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LZ1J101MT Datasheet(PDF) 10 Page - DB Lectro Inc |
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LZ1J101MT Datasheet(HTML) 10 Page - DB Lectro Inc |
10 / 13 page LEAD FREE REFLOW SOLDERING CONDITION (Applicable to Chip Type Aluminum Electrolytic Capacitors) Recommended Conditions for Reflow Soldering (1) A thermal condition system such as infrared radiation (IR) or hot blast should be adopted, and vapor heat transfer systems (VPS) are not recommended. (2) Reflow soldering should be performed one time. If the capacitor has to be reflowed twice, 30 minutes must be layout between each time. (3) For lead-free type reflow soldering, please observe proper conditions below: a) The time of preheating from 150°C to 200°C shall be within maximum 180 seconds; b) The time of soldering temperature at 217°C measured on capacitors' top shall not exceed tL (second); c) The peak temperature on capacitors' top shall not exceed Tp(°C), and the time within 5°C of actual peak temperature shall not exceed tp (second). Classification Reflow Profile *1. Average ramp-up rate is 3 /second max. *2. Ramp-down rate is 6 /second max. *3. Time from 25 to peak temperature is 8 minutes max. tp 20 0 25 21 7 Tp 15 0 t L 25 t o Peak * 3 Ramp-down Ramp-up *1 *2 P reheat 180 s ec Max Ti m e Critical Zone 217t oTp Allowable Range of Peak Temperature Size Thickness (mm) Volume (mm 3) Tp(°C) tL (second) tp (second) 4~ 6.3, 8 6.2L 2.5 <350 250±0 90 5 8 10.5L 2.5 350~2000 240±0 90 5 10 10.5L/13.5L 2.5 350~2000 235±0 60 5 12.5, 16 2.5 >2000 230±0 30 (20*) 5 Re: (20*) is special for mid-to-high voltage which is HU series. Recommended Land Size (Unit: mm) Size ab c 4 1.6 2.6 1.6 5 1.6 3.0 1.6 6.3 1.6 3.5 1.6 8×6.2L 2.1 4.5 1.6 8×10.5L 3.0 3.5 2.5 10 4.0 4.0 2.5 12.5 4.0 5.7 3.0 16×16.5/21.5 6.0 6.5 3.5 DB LECTRO Inc. 3755 Place Java, Suite 140, Brossard, Québec, J4Y 0E4, Canada - T: 1-450-444-1424 / F: 1-450-444-4714 / www.dblectro.com |
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