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WF5027C7-4 Datasheet(PDF) 2 Page - Nippon Precision Circuits Inc |
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WF5027C7-4 Datasheet(HTML) 2 Page - Nippon Precision Circuits Inc |
2 / 21 page WF5027 series SEIKO NPC CORPORATION —2 SERIES CONFIGURATION For Fundamental Oscillator For 3rd Overtone Oscillator VERSION NAME Operating supply voltage range [V] Output drive capability [mA] PAD layout Recommended oscillation frequency range*1 [MHz] *1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla- tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. Version*2 *2. Wafer form devices have designation WF5027 ×× and chip form devices have designation CF5027××. fO output fO/2 output fO/4 output fO/8 output fO/16 output fO/32 output fO/64 output 1.60 to 3.63 ± 4 Flip Chip Bonding 20 to 60 5027A1 5027A2 5027A3 5027A4 5027A5 5027A6 5027A7 60 to 100 5027AP 5027AQ 5027AR 5027AS 5027AT 5027AV 5027AW Wire Bonding Type I 20 to 60 5027B1 5027B2 5027B3 5027B4 5027B5 5027B6 5027B7 60 to 100 5027BP 5027BQ 5027BR 5027BS 5027BT 5027BV 5027BW Wire Bonding Type II 20 to 60 5027C1 5027C2 5027C3 5027C4 5027C5 5027C6 5027C7 60 to 100 5027CP 5027CQ 5027CR 5027CS 5027CT 5027CV 5027CW Operating supply voltage range [V] Output drive capability [mA] PAD layout Recommended oscillation frequency range*1 [MHz] and version*2 *1. The recommended oscillation frequency is a yardstick value derived from the crystal used for NPC characteristics authentication. However, the oscilla- tion frequency range is not guaranteed. Specifically, the characteristics can vary greatly due to crystal characteristics and mounting conditions, so the oscillation characteristics of components must be carefully evaluated. *2. Wafer form devices have designation WF5027 ×× and chip form devices have designation CF5027××. Versions in parentheses ( ) are under development. 40 to 50 50 to 65 65 to 85 85 to 110 110 to 145 145 to 180 1.60 to 3.63 ± 8 Flip Chip Bonding 5027MA 5027MB 5027MC 5027MD (5027QE) (5027QF) Wire Bonding Type I 5027NA 5027NB 5027NC 5027ND (5027RE) (5027RF) Wire Bonding Type II 5027PA 5027PB 5027PC 5027PD (5027SE) (5027SF) Device Package Version name WF5027 ××–4 Wafer form CF5027 ××–4 Chip form WF5027 −4 Oscillation frequency range, frequency divider function Pad layout type Form A, M, Q: for Flip Chip Bonding B, N, R: for Wire Bonding (type I) C, P, S: for Wire Bonding (type II) WF: Wafer form CF: Chip (Die) form |
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