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9

PACKAGE DIMENSIONS

UDFN6 2x2, 0.65P

CASE 517AB-01

ISSUE B

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.47

0.40

0.65

1.70

2.30

1

DIMENSIONS: MILLIMETERS

6X

0.95

PITCH

6X

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

C

A

SEATING

PLANE

D

B

E

0.10 C

A3

A

A1

2X

2X

0.10 C

DIM

A

MIN

MAX

MILLIMETERS

0.45

0.55

A1

0.00

0.05

A3

0.127 REF

b

0.25

0.35

D

2.00 BSC

D2

1.50

1.70

0.80

1.00

E

2.00 BSC

E2

e

0.65 BSC

K

0.25

0.35

L

PIN ONE

REFERENCE

0.08 C

0.10 C

6X

A

0.10 C

L

e

E2

b

B

3

6

6X

1

K

4

6X

6X

0.05 C

4X

D2

BOTTOM VIEW

0.20

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