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M393T1G60CJA-CE6 Datasheet(PDF) 2 Page - Samsung semiconductor |
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M393T1G60CJA-CE6 Datasheet(HTML) 2 Page - Samsung semiconductor |
2 / 26 page Rev. 1.4 November 2007 RDIMM DDR2 SDRAM 2 of 26 Table of Contents 1.0 DDR2 Registered DIMM Ordering Information ..........................................................................4 2.0 Features ........................................................................................................................................4 3.0 Address Configuration ................................................................................................................4 4.0 Pin Configurations (Front side/Back side) ................................................................................5 5.0Pin Description .............................................................................................................................5 6.0 Input/Output Function Description ............................................................................................6 7.0 Functional Block Diagram ...........................................................................................................7 7.1 2GB, 256Mx72 Module - M393T5663CZ3/M393T5663CZA ...................................................................7 7.2 2GB, 256Mx72 Module - M393T5660CZ3/M393T5660CZA ...................................................................8 7.3 4GB, 512MBx72 Module - M393T5160CZ3/M393T5160CZA .................................................................9 7.4 4GB, 512MBx72 Module - M392T5160CJ ........................................................................................10 7.5 8GB, 1GBx72 Module - M393T1G60CJA ........................................................................................ 11 8.0 Absolute Maximum DC Ratings ................................................................................................12 9.0 AC & DC Operating Conditions ................................................................................................12 9.1 Recommended DC Operating Conditions (SSTL - 1.8) .....................................................................12 9.2 Operating Temperature Condition ................................................................................................13 9.3 Input DC Logic Level ..................................................................................................................13 9.4 Input AC Logic Level ..................................................................................................................13 9.5 AC Input Test Conditions ............................................................................................................13 10.0 IDD Specification Parameters Definition ............................................................................... 14 11.0 Operating Current Table ..........................................................................................................15 11.1 M393T5663CZ3 / M393T5663CZA : 2GB(128Mx8 *18) Module .........................................................15 11.2 M393T5663CZ3 / M393T5663CZA : 2GB(128Mx8 *18) Module .........................................................15 11.3 M393T5660CZ3 / M393T5660CZA : 2GB(256Mx4 *18) Module .........................................................16 11.4 M393T5660CZ3 / M393T5660CZA : 2GB(256Mx4 *18) Module .........................................................16 11.5 M393T5160CZ3 / M393T5160CZA / M392T5160CJA : 4GB(256Mx4 *36 / 512Mx4 *18) Module ..............17 11.6 M393T5160CZ3 / M393T5160CZA / M392T5160CJA : 4GB(256Mx4 *36 / 512Mx4 *18) Module ..............17 11.7 M393T1G60CJA : 8GB(512Mx4 *36) Module ................................................................................18 11.8 M393T1G60CJA : 8GB(512Mx4 *36) Module .................................................................................18 12.0 Input/Output Capacitance .......................................................................................................19 13.0 Electrical Characteristics & AC Timing for DDR2-800/667/533/400 .....................................19 13.1 Refresh Parameters by Device Density ......................................................................................19 13.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ...........................................19 13.3 Timing Parameters by Speed Grade ..........................................................................................20 14.0 Physical Dimensions : .............................................................................................................22 14.1 128Mbx8/256Mbx4 based 256Mx72 Module (2/1 Ranks) ................................................................22 14.2 256Mbx4 based 512Mx72 Module (2 Ranks) ................................................................................23 14.3 DDP 512Mbx4 based 512Mx72 Module (2 Ranks) ........................................................................24 14.4 DDP 512Mbx4 based 1Gx72 Module (4 Ranks) ............................................................................25 15.0 240 Pin DDR2 Registered DIMM Clock Topology .................................................................26 |
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