MAX9213EUM datasheet(2/21 Pages) MAXIM

Part #	MAX9213EUM

Description	Programmable DC-Balanced 21-Bit Serializers

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Manufacturer	MAXIM [Maxim Integrated Products]

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Programmable DC-Balanced

21-Bit Serializers

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS

(VCC = +3.0V to +3.6V, RL = 100

Ω±1%, PWRDWN = high, DCB/NC = high or low, unless otherwise noted. Typical values are at VCC

= +3.3V, TA = +25

°C.) (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC to GND ...........................................................-0.5V to +4.0V

LVDS Outputs (TxOUT_, TxCLK OUT_) to GND ...-0.5V to +4.0V

5V Tolerant LVTTL/LVCMOS Inputs

(TxIN_, TxCLK IN, PWRDWN) to GND ..............-0.5V to +6.0V

(DCB/NC) to GND ......................................-0.5V to (VCC + 0.5V)

LVDS Outputs (TxOUT_, TxCLK OUT_)

Short to GND and Differential Short .......................Continuous

Continuous Power Dissipation (TA = +70°C)

48-Pin TSSOP (derate 16mW/°C above +70°C) ....... 1282mW

48-Lead QFN (derate 26.3mW/°C above +70°C) ......2105mW

Storage Temperature Range .............................-65°C to +150°C

Junction Temperature ......................................................+150°C

ESD Protection

Human Body Model (RD = 1.5k

Ω, CS = 100pF)

All Pins to GND..............................................................

±2kV

IEC 61000-4-2 (RD = 330

Ω, CS = 150pF)

Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....

±8kV

Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..

±15kV

ISO 10605 (RD = 2k

Ω, CS = 330pF)

Contact Discharge (TxOUT_, TxCLK OUT_) to GND ....

±8kV

Air Gap Discharge (TxOUT_, TxCLK OUT_) to GND ..

±25kV

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SINGLE-ENDED INPUTS (TxIN_, TxCLK IN,

PWRDWN, DCB/NC)

TxIN_, TxCLK IN, PWRDWN

2.0

5.5

High-Level Input Voltage

VIH

DCB/NC

2.0

VCC +

0.3

V

Low-Level Input Voltage

VIL

-0.3

+0.8

V

Input Current

IIN

VIN = high or low, PWRDWN = high or low

-20

+20

µA

Input Clamp Voltage

VCL

ICL = -18mA

-0.9

-1.5

V

LVDS OUTPUTS (TxOUT_, TxCLK OUT)

Differential Output Voltage

VOD

Figure 1

250

350

450

mV

Change in VOD Between

Complementary Output States

∆VOD

Figure 1

2

25

mV

Output Offset Voltage

VOS

Figure 1

1.125

1.25

1.375

V

Change in VOS Between

Complementary Output States

∆VOS

Figure 1

10

30

mV

VOUT+ or VOUT- = 0V or VCC,

non-DC-balanced mode

-10

±5.7

+10

Output Short-Circuit Current

IOS

VOUT+ or VOUT- = 0V or VCC,

DC-balanced mode

-15

±8.2

+15

mA

VOD = 0V, non-DC-balanced mode

(Note 3)

5.7

10

Magnitude of Differential Output

Short-Circuit Current

IOSD

VOD = 0V, DC-balanced mode (Note 3)

8.2

15

mA

78

110

147

DC-balanced mode

-40°C to +105°C

78

110

150

292

410

547

Differential Output Resistance

RO

Non-DC-balanced

mode

-40°C to +105°C

292

410

564

Ω

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