BUK75_764R0-55B_4

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 04 — 4 October 2007

4 of 14

NXP Semiconductors

BUK754R0-55B; BUK764R0-55B

N-channel TrenchMOS standard level FET

5.

Thermal characteristics

Table 4.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from junction to

mounting base

-

-

0.5

K/W

thermal resistance from junction to ambient

SOT78A (TO-220AB)

vertical in free air

-

60

-

K/W

SOT404 (D2PAK)

mounted on a printed-circuit board;

minimum footprint

-

50

-

K/W

Fig 4.

Transient thermal impedance from junction to mounting base as a function of pulse duration

03ng56

10

-3

10

-2

10

-1

1

10

-6

10

-5

10

-4

10

-3

10

-2

10

-1

1

(K/W)

δ = 0.5

0.02

single shot

0.05

0.1

0.2

T

P

t

T

δ =