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BUK75 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BUK75 Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 14 page BUK75_7608-40B_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 16 November 2007 4 of 14 NXP Semiconductors BUK75/7608-40B N-channel TrenchMOS standard level FET 5. Thermal characteristics [1] Vertical in still air; SOT78 package. [2] mounted on a printed circuit board; minimum footprint; SOT404 package Table 4. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base see Figure 4 - - 0.95 K/W Rth(j-a) thermal resistance from junction to ambient [1] - 60 - K/W [2] - 50 - K/W Fig 4. Transient thermal impedance from junction to mounting bast as a function of pulse duration 003aac080 10−6 10−1 1 10−2 10−3 10−5 10−4 10−1 10−2 1 10−3 tp (s) Zth(j − mb) (K/W) tp tp T P t T δ = single pulse 0.2 0.1 0.05 0.02 δ = 0.5 |
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