In our continuing strategy to deliver unparalleled circuit protection solutions,

technical expertise and application leadership, we proudly introduce the

WICKMANN Group and its products to the Littelfuse portfolio.

040706

www.littelfuse.com

Dimensions (mm)

Model

A

B

C

D

E

Physical Characteristics

packaging quantity

Max

Max

typ

Min

Max

Lead

Material

bag

ammo

RLD60P010X

7.4

12.7

5.1

7.6

3.1

0.51 dia.

Sn/CuFe

500

2,000

RLD60P017X

7.4

12.7

5.1

7.6

3.1

0.51 dia.

Sn/CuFe

500

2,000

RLD60P020X

7.4

12.2

5.1

7.6

3.1

0.51 dia.

Sn/CuFe

500

2,000

RLD60P025X

7.4

12.7

5.1

7.6

3.1

0.51 dia.

Sn/CuFe

500

2,000

RLD60P030X

7.4

13.0

5.1

7.6

3.1

0.51 dia.

Sn/CuFe

500

2,000

RLD60P040X

7.6

13.5

5.1

7.6

3.1

0.51 dia.

Sn/CuFe

500

2,000

RLD60P050X

7.9

13.7

5.1

7.6

3.1

0.51 dia.

Sn/Cu

500

2,000

RLD60P065X

9.7

14.5

5.1

7.6

3.1

0.51 dia.

Sn/Cu

500

2,000

RLD60P075X

10.4

15.2

5.1

7.6

3.1

0.51 dia.

Sn/Cu

500

2,000

RLD60P090X

11.7

15.7

5.1

7.6

3.1

0.51 dia.

Sn/Cu

500

2,000

RLD60P110X

13.0

18.0

5.1

7.6

3.1

0.81 dia.

Sn/Cu

500

1,000

RLD60P135X

14.5

19.6

5.1

7.6

3.1

0.81 dia.

Sn/Cu

100

1,000

RLD60P160X

16.3

21.3

5.1

7.6

3.1

0.81 dia.

Sn/Cu

100

1,000

RLD60P185X

17.8

22.9

5.1

7.6

3.1

0.81 dia.

Sn/Cu

100

1,000

RLD60P250X

21.3

26.4

10.2

7.6

3.1

0.81 dia.

Sn/Cu

100

1,000

RLD60P300X

24.9

30.0

10.2

7.6

3.1

0.81 dia.

Sn/Cu

100

1,000

RLD60P375X

28.4

33.5

10.2

7.6

3.1

0.81 dia.

Sn/Cu

100

800

Order

Qty.

Order-

Model

* Packaging

Information

Number

* optional "F" for lead free devices

Dimensions (mm)

Specifications

Packaging

A*

bulk

G

tape and reel

F*

tape and ammo

* preferred type

Materials

Insulating Material: Yellow Epoxy Polymer,

UL 94 V-0

Round Pins:

Copper alloy, tin plated

Max. Device Surface Temperature in Tripped State

125 °C

Operating / Storage Temperature

-40 ºC to +85 ºC (consider derating)

Humidity Ageing

+85 °C, 85 % R.H., 1000 hours, ± 5 % typical

resistance change

Soldering Characteristics

Solderability per MIL-STD-202, Method 208E

Thermal Shock

MIL-STD-202F, Method 107G

+125 °C to -40 °C 10 times, ±10 % typical

resistance change

Solvent Resistance

MIL-STD-202, Method 215F, no change

Marking

“P”, voltage, amperage rating, lot number

Radial Leaded, 60 V

Standard

CSA C22.2 No. 0 CSA TIL No. CA-3A

Approvals

cULus Recognition

TÜV

Features

These 60V RLDs were designed to be general-

purpose resettable fuses. As such, they are

capable of protecting a large variety of circuits,

including power supplies, speakers, security and

alarm systems, certain motors etc.

RLD60

RLD60P010X

0.10

0.20

60

40

4.00 @ 0.50

0.38

2.500

7.500

•

p

RLD60P017X

0.17

0.34

60

40

3.00 @ 0.85

0.48

3.300

8.000

•

p

RLD60P020X

0.20

0.40

60

40

2.20 @ 1.00

0.41

1.830

4.400

•

•

RLD60P025X

0.25

0.50

60

40

2.50 @ 1.25

0.45

1.250

3.000

•

•

RLD60P030X

0.30

0.60

60

40

3.00 @ 1.50

0.49

0.880

2.100

•

•

RLD60P040X

0.40

0.80

60

40

3.80 @ 2.00

0.56

0.550

1.290

•

•

RLD60P050X

0.50

1.00

60

40

4.00 @ 2.50

0.77

0.500

1.170

•

•

RLD60P065X

0.65

1.30

60

40

5.30 @ 3.25

0.88

0.310

0.720

•

•

RLD60P075X

0.75

1.50

60

40

6.30 @ 3.75

0.92

0.250

0.600

•

•

RLD60P090X

0.90

1.80

60

40

7.20 @ 4.50

0.99

0.200

0.470

•

•

RLD60P110X

1.10

2.20

60

40

8.20 @ 5.50

1.50

0.150

0.380

•

•

RLD60P135X

1.35

2.70

60

40

9.60 @ 6.75

1.70

0.120

0.300

•

•

RLD60P160X

1.60

3.20

60

40

11.40 @ 8.00

1.90

0.090

0.220

•

•

RLD60P185X

1.85

3.70

60

40

12.60 @ 9.25

2.10

0.080

0.190

•

•

RLD60P250X

2.50

5.00

60

40

15.60 @ 12.50

2.50

0.050

0.130

•

•

RLD60P300X

3.00

6.00

60

40

19.80 @ 15.00

2.80

0.040

0.100

•

•

RLD60P375X

3.75

7.50

60

40

24.00 @ 18.75

3.20

0.030

0.080

•

•

Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).

NOTE:

I

Hold current: maximum current device will pass without tripping in 20 °C still air.

I

Trip current: minimum current at which the device will trip in 20 °C still air.

V

Maximum voltage device can withstand without damage at rated current (I

I

Maximum fault current device can withstand without damage at rated voltage (V

P

Power dissipated from device when in the tripped state at 20 °C still air.

R

Minimum resistance of device in initial (un-soldered) state.

R

Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.

Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.

Specifications are subject to change without notice

Model

I

hold

I

Trip

V

max. dc

I

max.

max. time to trip

P

d max.

Resistance

Approvals

(A)

(A)

(V)

(A)

(s @ A)

(W)

R

R