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TLC2801Y Datasheet(PDF) 2 Page - Texas Instruments |
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TLC2801Y Datasheet(HTML) 2 Page - Texas Instruments |
2 / 13 page TLC2801Z, TLC2801Y Advanced LinCMOS ™ LOW-NOISE PRECISION OPERATIONAL AMPLIFIERS SLOS116B – JULY 1982 – REVISED SEPTEMBER 1996 3–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 AVAILABLE OPTIONS VIOmax PACKAGED DEVICES CHIP TA VIOmax AT 150 °C SMALL OUTLINE (D) PLASTIC DIP (P) FORM (Y) –40 °C to 150°C 1.5 mV TLC2801ZD TLC2801ZP TLC2801Y The D packages are available taped and reeled. Add R suffix to the device type when ordering (e.g., TLC2801ZDR). TLC2801Y chip information This chip, properly assembled, displays characteristics similar to the TLC2801. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax= 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (4) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + – OUT IN + IN – VCC+ (7) (3) (2) (6) (4) VCC – / GND (2) (3) (4) (6) (7) 80 90 |
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