King Billion Electronics Co., Ltd

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HF88M32B

January 16, 2004

6

V1.11

This specification is subject to change without notice. Please contact sales person for the latest version before use.

Die Size: X= 40130 µm, Y=7138 µm, and substrate is connected to GND.

Pad No.

Pad Name

X Coord.

Y Coord. Pad No. Pad Name

X Coord.

Y Coord.

1

NC

-1941.5

3231.86

31

GND

1941.5

-3262.78

2

GND

-1941.5

3008.86

32

GND

1941.5

-3039.78

3

RS0

-1941.5

2785.86

33

GND

1941.5

-2816.78

4

P17

-1941.5

2562.86

34

OEN

1941.5

-2593.78

5

P16

-1941.5

2339.86

35

D0

1941.5

-2370.78

6

P15

-1941.5

2116.86

36

NC

1941.5

-2140.78

7

P14

-1941.5

1893.86

37

D1

1941.5

-1917.78

8

P13

-1941.5

1670.86

38

NC

1941.5

-1687.78

9

P12

-1941.5

1447.86

39

D2

1941.5

-1464.78

10

P11

-1941.5

1224.86

40

NC

1941.5

-1234.78

11

P10

-1941.5

1001.86

41

D3

1941.5

-1011.78

12

WEN

-1941.5

778.86

42

NC

1941.5

-781.78

13

GND

-1941.5

555.86

43

VDD

1941.5

-558.78

14

NC

-1941.5

332.86

44

GND

1941.5

-335.78

15

GND

-1941.5

-34.78

45

VDD

1941.5

-112.78

16

NC

-1941.5

-257.78

46

GND

1941.5

110.22

17

GND

-1941.5

-480.78

47

VDD

1941.5

333.22

18

NC

-1941.5

-703.78

48

GND

1941.5

712.16

19

RS2

-1941.5

-926.78

49

D4

1941.5

935.16

20

RS1

-1941.5

-1149.78

50

NC

1941.5

1165.16

21

P07

-1941.5

-1372.78

51

D5

1941.5

1388.16

22

P06

-1941.5

-1595.78

52

NC

1941.5

1618.16

23

P05

-1941.5

-1818.78

53

D6

1941.5

1841.16

24

P04

-1941.5

-2041.78

54

NC

1941.5

2071.16

25

P03

-1941.5

-2264.78

55

D7

1941.5

2294.16

26

P02

-1941.5

-2487.78

56

NC

1941.5

2517.16

27

P01

-1941.5

-2710.78

57

GND

1941.5

2740.16

28

P00

-1941.5

-2931.48

58

GND

1941.5

2963.16

29

CEN

-1941.5

-3152.18

59

GND

1941.5

3186.16

30

NC

-1941.5

-3372.88

NC: No Connection

6.Device Operation

The device provides the capability of accessing the contents of ROM array by external MCU not through

standard address and data bus configuration but through minimal number of 8-bit data bus and control

pins. Only 11 pins D7 ~ D0, CEn, OEn, WEn are required to use the device as a Data File device. By

fixing the RS2 pin to ‘0’, only CEn, WEn, OEn and D0 ~ D7 are required to access the ROM array data.

The CEn pin is device selection pin to uniquely select one device when more than one device are used in

parallel and control the access to Mask ROM contents and internal registers. Whenever CEn goes high,

the internal Mask ROM will enter standby (power saving) mode and accesses to internal registers are

inhibited. Otherwise, it is in active mode. Therefore, when accessing contents of ROM is not intended, the