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HF88M32B Datasheet(PDF) 6 Page - King blillion Electronics Co.,Ltd. |
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HF88M32B Datasheet(HTML) 6 Page - King blillion Electronics Co.,Ltd. |
6 / 15 page King Billion Electronics Co., Ltd 駿 億 電 子 股 份 有 限 公 司 HF88M32B January 16, 2004 6 V1.11 This specification is subject to change without notice. Please contact sales person for the latest version before use. Die Size: X= 40130 µm, Y=7138 µm, and substrate is connected to GND. Pad No. Pad Name X Coord. Y Coord. Pad No. Pad Name X Coord. Y Coord. 1 NC -1941.5 3231.86 31 GND 1941.5 -3262.78 2 GND -1941.5 3008.86 32 GND 1941.5 -3039.78 3 RS0 -1941.5 2785.86 33 GND 1941.5 -2816.78 4 P17 -1941.5 2562.86 34 OEN 1941.5 -2593.78 5 P16 -1941.5 2339.86 35 D0 1941.5 -2370.78 6 P15 -1941.5 2116.86 36 NC 1941.5 -2140.78 7 P14 -1941.5 1893.86 37 D1 1941.5 -1917.78 8 P13 -1941.5 1670.86 38 NC 1941.5 -1687.78 9 P12 -1941.5 1447.86 39 D2 1941.5 -1464.78 10 P11 -1941.5 1224.86 40 NC 1941.5 -1234.78 11 P10 -1941.5 1001.86 41 D3 1941.5 -1011.78 12 WEN -1941.5 778.86 42 NC 1941.5 -781.78 13 GND -1941.5 555.86 43 VDD 1941.5 -558.78 14 NC -1941.5 332.86 44 GND 1941.5 -335.78 15 GND -1941.5 -34.78 45 VDD 1941.5 -112.78 16 NC -1941.5 -257.78 46 GND 1941.5 110.22 17 GND -1941.5 -480.78 47 VDD 1941.5 333.22 18 NC -1941.5 -703.78 48 GND 1941.5 712.16 19 RS2 -1941.5 -926.78 49 D4 1941.5 935.16 20 RS1 -1941.5 -1149.78 50 NC 1941.5 1165.16 21 P07 -1941.5 -1372.78 51 D5 1941.5 1388.16 22 P06 -1941.5 -1595.78 52 NC 1941.5 1618.16 23 P05 -1941.5 -1818.78 53 D6 1941.5 1841.16 24 P04 -1941.5 -2041.78 54 NC 1941.5 2071.16 25 P03 -1941.5 -2264.78 55 D7 1941.5 2294.16 26 P02 -1941.5 -2487.78 56 NC 1941.5 2517.16 27 P01 -1941.5 -2710.78 57 GND 1941.5 2740.16 28 P00 -1941.5 -2931.48 58 GND 1941.5 2963.16 29 CEN -1941.5 -3152.18 59 GND 1941.5 3186.16 30 NC -1941.5 -3372.88 NC: No Connection 6.Device Operation The device provides the capability of accessing the contents of ROM array by external MCU not through standard address and data bus configuration but through minimal number of 8-bit data bus and control pins. Only 11 pins D7 ~ D0, CEn, OEn, WEn are required to use the device as a Data File device. By fixing the RS2 pin to ‘0’, only CEn, WEn, OEn and D0 ~ D7 are required to access the ROM array data. The CEn pin is device selection pin to uniquely select one device when more than one device are used in parallel and control the access to Mask ROM contents and internal registers. Whenever CEn goes high, the internal Mask ROM will enter standby (power saving) mode and accesses to internal registers are inhibited. Otherwise, it is in active mode. Therefore, when accessing contents of ROM is not intended, the |
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