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RT9301 Datasheet(PDF) 8 Page - Richtek Technology Corporation |
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RT9301 Datasheet(HTML) 8 Page - Richtek Technology Corporation |
8 / 9 page RT9301 8 DS9301-02 March 2007 www.richtek.com Layout Consideration For best performance, careful PCB layout is necessary. Place all peripheral components as close to the IC as possible. A short connection is highly recommended. The following guidelines should be strictly followed when designing a PCB layout for the RT9301. 1. All the traces of LED and VIN pin running from chip to LEDs should be wide and short to reduce the parasitic connection resistance. 2. Input capacitor (CIN) must be placed close to LEDs and connected to ground plane. The anodes of LEDs must be connected to CIN, not battery directly. 3. Current setting resistors RSET should be placed as close to the chip as possible. 4. The GND should be connected to a strong ground plane for heat sinking and noise protection. 5. The current setting resistors should be placed as close to the IC as possible. The maximum power dissipation depends on operating ambient temperature for fixed TJ (MAX) and thermal resistance θJA . For RT9301 packages, the Figure 6 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Figure 6. Derating Curves for RT9301 Packages 0 50 100 150 200 250 300 350 400 450 500 0 20 40 60 80 100 120 140 Ambient Temperature (°C) Single Layer PCB Battery Ground Plane All the traces of LED and V IN running from chip to LEDs should be wide and short to reduce the parasitic connection resistance. Input capacitor (C IN) should be placed close to LEDs Pin and connected to ground plane. The Anodes of LEDs must connect to C IN, not battery directly. The GND should be connected to a strong ground plane for heat sinking and noise protection. ISET3 VIN GND LED3 LED2 LED1 ISET1 ISET2 5 2 3 7 8 1 4 6 Figure 7. PCB Layout Guide |
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