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RT9011-MPPJ6 Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9011-MPPJ6 Datasheet(HTML) 10 Page - Richtek Technology Corporation |
10 / 12 page RT9011 Preliminary 10 DS9011-05 August 2007 www.richtek.com Figure 3. Derating Curves for RT9011 Packages For recommended operating conditions specification of RT9011, where TJ(MAX) is the maximum junction temperature of the die (125 °C) and TA is the operated ambient temperature. The junction to ambient thermal resistance ( θJA is layout dependent) for TSOT-23-6 package is 220 °C/W and WDFN-8L 2x2 is 165°C/W on the standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by following formula : PD(MAX) = ( 125 °C - 25°C ) / 220 = 0.455 W for TSOT-23-6 packages PD(MAX) = ( 125 °C - 25°C ) / 165 = 0.606 W for WDFN-8L 2x2 packages The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For RT9011 packages, the Figure 3 of de- rating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Power Dissipation vs. Ambient Temperature 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 25 50 75 100 125 Ambient Temperature ( °C) WDFN-8L 2x2 TSOT-23-6 |
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