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Advanced Product Information

December 14, 2001

TGA4501-EPU

6

Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process

specifications. Specifications are subject to change without notice.

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Chip Assembly & Bonding Diagram

Note: Please refer to page 8 for a magnified view of the chip assembly and bonding diagram