W25X16, W25X32, W25X64

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Table of Contents

1.

GENERAL DESCRIPTION ......................................................................................................... 4

2.

FEATURES ................................................................................................................................. 4

3.

PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5

4.

PIN CONFIGURATION WSON 6X5-MM .................................................................................... 5

5.

PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6

6.

PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, AND WSON 6X5-MM ............................... 6

7.

PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7

8.

PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7

8.1

Package Types ............................................................................................................... 8

8.2

Chip Select (/CS) ............................................................................................................ 8

8.3

Serial Data Output (DO) ................................................................................................. 8

8.4

Write Protect (/WP)......................................................................................................... 8

8.5

HOLD (/HOLD) ............................................................................................................... 8

8.6

Serial Clock (CLK) .......................................................................................................... 8

8.7

Serial Data Input / Output (DIO) ..................................................................................... 8

9.

BLOCK DIAGRAM ...................................................................................................................... 9

10.

FUNCTIONAL DESCRIPTION ................................................................................................. 10

10.1

SPI OPERATIONS ....................................................................................................... 10

10.1.1

SPI Modes ....................................................................................................................10

10.1.2

Dual Output SPI............................................................................................................10

10.1.3

Hold Function ...............................................................................................................10

10.2

WRITE PROTECTION.................................................................................................. 11

10.2.1

Write Protect Features..................................................................................................11

11.

CONTROL AND STATUS REGISTERS................................................................................... 12

11.1

STATUS REGISTER .................................................................................................... 12

11.1.1

BUSY............................................................................................................................12

11.1.2

Write Enable Latch (WEL) ............................................................................................12

11.1.3

Block Protect Bits (BP2, BP1, BP0)..............................................................................12

11.1.4

Top/Bottom Block Protect (TB) .....................................................................................12

11.1.5

Reserved Bits ...............................................................................................................12

11.1.6

Status Register Protect (SRP) ......................................................................................13

11.1.7

Status Register Memory Protection ..............................................................................14

11.2

INSTRUCTIONS ........................................................................................................... 16

11.2.1

Manufacturer and Device Identification.........................................................................16

11.2.2

Instruction Set...............................................................................................................17

11.2.3

Write Ensable (06h) ......................................................................................................18