Internet Data Sheet

Rev. 1.01, 2006-09

4

03062006-PK3L-ZYSE

HYS72T256322HP–[3S/3.7]–A

Registered DDR2 SDRAM Modules

1.2

Description

The Qimonda HYS72T256322HP–[3S/3.7]–A module family

are Very Low Profile (VLP) Registered Dual-Die DIMM

(RDIMM with parity) with 18.30 mm height based on DDR2

technology. DIMMs are available as ECC modules in

256M x 72 (2 GByte) organization and density, intended for

mounting into 240-Pin connector sockets.

The memory array is designed with 512-Mbit Double-Data-

Rate-Two (DDR2) Synchronous DRAMs. All control and

address signals are re-driven on the DIMM using register

devices and a PLL for the clock distribution. This reduces

capacitive loading to the system bus, but adds one cycle to

the SDRAM timing. Decoupling capacitors are mounted on

the PCB board. The DIMMs feature serial presence detect

protocol. The first 128 bytes are programmed with

configuration data and the second 128 bytes are available to

the customer.

TABLE 2

Ordering Information for RoHS Compliant Products

TABLE 3

Address Format

TABLE 4

Components on Modules

1) All part numbers end with a place code, designating the silicon die revision. Example: HYS72T256322HP–3.7–A, indicating Rev. “A” dies

are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet.

2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200P–444–12–W0”, where

4200P means Registered Parity DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe (CAS)

latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and

produced on the Raw Card “W”

Description

SDRAM Technology

PC2-5300

HYS72T256322HP–3S–A

2 GB 2R

×4 PC2–5300P–555–12–W0

2 Ranks, ECC

512 Mbit (

×4)

PC2-4200

HYS72T256322HP–3.7–A

2 GB 2R

×4 PC2–4200P–444–12–W0

2 Ranks, ECC

512 Mbit (

×4)

DIMM

Density

Module

Organization

Memory

Ranks

ECC/

Non-ECC

# of

SDRAMs

# of row/bank/columns bits

Raw Card

2 GB

256M

× 72

2

ECC

18

14/2/11

W

1) Green Product

DRAM Components1)

DRAM Density

DRAM Organization

2) For a detailed description of all available functions of the DRAM components on these modules see the component data sheet.

HYS72T256322HP

HYB18T1G402AF

512 Mbit

2 x 128M

× 4