Internet Data Sheet

Rev. 1.11, 2006-09

4

03062006-TZ8J-GNDA

HYS72T512020HR–[3.7/5]–A

Registered DDR2 SDRAM Modules

1.2

Description

The Qimonda HYS72T512020HR–[3.7/5]–A module family

are Registered DIMM modules “RDIMMs” with 50,0 mm

height based on DDR2 technology.

DIMMs are available as ECC modules in 512M x 72

(4 GByte) organization and density, intended for mounting

into 240-Pin connector sockets.The memory array is

designed

with

1-Gbit

Double-Data-Rate-Two

(DDR2)

Synchronous DRAMs. All control and address signals are re-

driven on the DIMM using register devices and a PLL for the

clock distribution. This reduces capacitive loading to the

system bus, but adds one cycle to the SDRAM timing.

Decoupling capacitors are mounted on the PCB board. The

DIMMs feature serial presence detect based on a serial

128 bytes are programmed with configuration data and the

second 128 bytes are available to the customer.

TABLE 2

Ordering Information for RoHS Compliant Products

TABLE 3

Address Format

TABLE 4

Components on Modules

1) All part numbers end with a place code, designating the silicon die revision. Example: HYS72T512020HR–5–A, indicating Rev. “A” dies

are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet.

2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200R–444–11–ZZ”, where

4200R means Registered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-11” means Column Address Strobe (CAS) latency

= 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.1 and produced

on the Raw Card “ZZ”

Description

SDRAM Technology

PC2–4200

HYS72T512020HR–3.7–A

4 GB 2R

×4 PC2–4200R–444–11–ZZ

2 Ranks, ECC

1 Gbit (

×4)

PC2-3200

HYS72T512020HR–5–A

4 GB 2R

×4 PC2–3200R–333–11–ZZ

2 Ranks, ECC

1 Gbit (

×4)

DIMM

Density

Module

Organization

Memory

Ranks

ECC/

Non-ECC

# of

SDRAMs

# of row/bank/columns bits

Raw Card

4 GB

512M

× 72

2

ECC

36

14/3/11

ZZ

1) Green Product

DRAM Components1)

DRAM Density

DRAM Organization

2) For a detailed description of all available functions of the DRAM components on these modules see the component data sheet.

HYS72T512020HR

HYB18T1G400AF

1 Gbit

256M

× 4