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A2516PM-F Datasheet(PDF) 10 Page - AMIC Technology

Part # A2516PM-F
Description  16 Mbit, Low Voltage, Serial Flash Memory With 85MHz SPI Bus Interface
Download  38 Pages
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Manufacturer  AMICC [AMIC Technology]
Direct Link  http://www.amictechnology.com
Logo AMICC - AMIC Technology

A2516PM-F Datasheet(HTML) 10 Page - AMIC Technology

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A25L16P Series
PRELIMINARY
(April, 2007, Version 0.6)
9
AMIC Technology Corp.
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of
the device, most significant bit first.
Serial Data Input (DIO) is sampled on the first rising edge of
Serial Clock (C) after Chip Select (
S ) is driven Low. Then,
the one-byte instruction code must be shifted in to the device,
most significant bit first, on Serial Data Input (DIO), each bit
being latched on the rising edges of Serial Clock (C).
The instruction set is listed in Table 3.
Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by
address bytes, or by data bytes, or by both or none.
In the case of a Read Data Bytes (READ), Read Data Bytes
at Higher Speed (Fast_Read), Read Status Register (RDSR)
or
Release
from
Deep
Power-down,
Read
Device
Identification
and
Read
Electronic
Signature
(RES)
instruction, the shifted-in instruction sequence is followed by
a data-out sequence. Chip Select (
S ) can be driven High
after any bit of the data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Bulk
Erase (BE), Write Status Register (WRSR), Write Enable
(WREN), Write Disable (WRDI) or Deep Power-down (DP)
instruction, Chip Select (
S ) must be driven High exactly at a
byte boundary, otherwise the instruction is rejected, and is
not executed. That is, Chip Select (
S ) must driven High
when the number of clock pulses after Chip Select (
S ) being
driven Low is an exact multiple of eight.
All attempts to access the memory array during a Write
Status Register cycle, Program cycle or Erase cycle are
ignored, and the internal Write Status Register cycle,
Program cycle or Erase cycle continues unaffected.
Table 3. Instruction Set
Instruction
Description
One-byte
Instruction Code
Address
Bytes
Dummy
Bytes
Data
Bytes
WREN
Write Enable
0000 0110
06h
0
0
0
WRDI
Write Disable
0000 0100
04h
0
0
0
RDSR
Read Status Register
0000 0101
05h
0
0
1 to ∞
WRSR
Write Status Register
0000 0001
01h
0
0
1
READ
Read Data Bytes
0000 0011
03h
3
0
1 to ∞
FAST_READ
Read Data Bytes at Higher Speed
0000 1011
0Bh
3
1
1 to ∞
FAST_READ_DUAL
_OUTPUT
Read Data Bytes at Higher Speed by
Dual Output
(1)
00111011
3Bh
3
1
1 to ∞
FAST_READ_DUAL
_INPUT-OUTPUT
Read Data Bytes at Higher Speed by
Dual Input and Dual Output
(1)
10111011
BBh
3
(2)
1
(2)
1 to ∞
PP
Page Program
0000 0010
02h
3
0
1 to 256
SE
Sector Erase
1101 1000
D8h
3
0
0
BE
Bulk Erase
1100 0111
or
01100000
C7h
or
60h
0
0
0
DP
Deep Power-down
1011 1001
B9h
0
0
0
RDID
Read Device Identification
1001 1111
9Fh
0
0
1 to 4
Release from Deep Power-down, and
Read Electronic Signature
0
3
1 to ∞
RES
Release from Deep Power-down
1010 1011
ABh
0
0
0
Note: (1) DIO = (D6, D4, D2, D0)
DO = (D7, D5, D3, D1)
(2) Dual Input, DIO = (A22, A20, A18, ………, A6, A4, A2, A0)
DO = (A23, A21, A19, …….., A7, A5, A3, A1)


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