W25P10, W25P20 AND W25P40

Publication Release Date: November 28, 2005

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Revision M

7.2.11

Chip Erase (C7h) ..........................................................................................................20

7.2.12

Power-down (B9h) ........................................................................................................21

7.2.13

Release Power-down / Device ID (ABh) .......................................................................22

7.2.14

Read Manufacturer / Device ID (90h) ...........................................................................24

8.

ELECTRICAL CHARACTERISTICS......................................................................................... 25

8.1

Absolute Maximum Ratings (1) .................................................................................... 25

8.2

Operating Ranges......................................................................................................... 25

8.3

Power-up Timing and Write Inhibit Threshold .............................................................. 26

8.4

DC Electrical Characteristics (Preliminary)(1) .............................................................. 27

8.5

AC Measurement Conditions........................................................................................ 28

8.6

AC Electrical Characteristics ........................................................................................ 29

8.7

AC Electrical Characteristics (cont’d) ........................................................................... 30

8.8

Serial Output Timing ..................................................................................................... 31

8.9

Input Timing .................................................................................................................. 31

8.10

Hold Timing................................................................................................................... 31

9.

PACKAGE SPECIFICATION .................................................................................................... 32

9.1

8-Pin SOIC 150-mil (Winbond Package Code SN) (NexFlash Package Code N) ....... 32

10.

ORDERING INFORMATION .................................................................................................... 33

11.

REVISION HISTORY ................................................................................................................ 34