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©2006 Littelfuse

Surface Mount

1812L Series

Specifications are subject to change without notice.



Electronics Designers Guide

Environmental Specifications

Soldering Parameters

Condition

Reflow

Peak Temp/ Duration Time

260°C / 10 Sec

Time above liquids (TAL) 220°C

60 Sec ~ 100 Sec

Preheat 120°C~ 180°C

50 Sec ~ 150 Sec

Storage Condition

0°C~35°C, <

=70%RH

• Recommended reflow methods: IR, vapor phase oven, hot air

oven, N

• Devices are not designed to be wave soldered to the bottom side

of the board.

• Recommended maximum paste thickness is 0.25mm (0.010 inch)

• Devices can be cleaned using standard industry methods and

solvents.

Note: If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

Operating/Storage

Temperature

-40°C to +85°C

Maximum Device Surface

Temperature in Tripped State

125°C

Passive Aging

+85°C, 1000 hours

±5% typical resistance change

Humidity Aging

+85°C, 85%R.H. 1000 hours

±5% typical resistance change

Thermal Shock

MIL-STD-202 Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Solvent Resistance

MIL-STD-202, Method 215

No change

Vibration

MIL-STD-883C, Method 2007.1,

Condition A

No change

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material:

Matte Tin (Sn))

Lead Solderability

Meets EIA Specification RS186-9E, ANSI/

J-STD-002 Category 3.

Preheating

120

180

220

260

0

60 to 100

Soldering

Cooling

120

50 to 150

Time(s)