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HT83XXX Datasheet(PDF) 5 Page - Holtek Semiconductor Inc |
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HT83XXX Datasheet(HTML) 5 Page - Holtek Semiconductor Inc |
5 / 39 page HT83050/HT83074 Pad No. X Y Pad No. X Y 1 -940.400 7.150 12 -654.200 -887.900 2 -940.400 -87.850 13 -551.200 -887.900 3 -940.400 -190.850 14 940.400 -871.200 4 -940.400 -285.850 15 940.400 -776.200 5 -940.400 -388.850 16 940.600 -668.500 6 -940.400 -483.850 17 940.600 -573.000 7 -940.400 -586.850 18 896.250 -463.250 8 -940.400 -681.850 19 904.900 -363.250 9 -947.200 -887.900 20 904.900 -243.700 10 -852.200 -887.900 21 904.900 -33.200 11 -749.200 -887.900 Pad Description Pad Name I/O Mask Option Description PA0~PA7 I/O Wake-up, Pull-high or None Bidirectional 8-bit I/O port. Each bit can be configured as a wake-up input by mask option. Software instructions determine the output or Schmitt trig- ger input with or without pull-high resistor (mask option). PB0~PB3 I/O Pull-high or None Bidirectional 4-bit I/O port. Software instructions determine the CMOS output or Schmitt trigger input (pull-high resistor depending on mask option). ¾¾ Negative power supply, ground ¾¾ Positive power supply ¾¾ PWM negative power supply, ground ¾¾ PWM positive power supply, ground RES I ¾ Schmitt trigger reset input, active low OSC1, OSC2 ¾ RC or Crystal OSC1 and OSC2 are connected to an RC network or crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/4 system clock. The system clock may came form the crystal, the two pins cannot be floating. PWM1, PWM2 O ¾ PWM output for driving a external transistor or speaker Absolute Maximum Ratings Supply Voltage ..........................VSS+2.4V to VSS+5.5V Storage Temperature ........................... -50°Cto125°C Input Voltage .............................VSS -0.3V to VDD+0.3V Operating Temperature .......................... -20°Cto70°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. HT83XXX Rev. 1.20 5 May 17, 2007 |
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