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SC1566 Datasheet(PDF) 8 Page - Semtech Corporation |
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SC1566 Datasheet(HTML) 8 Page - Semtech Corporation |
8 / 12 page 8 2005 Semtech Corp. www.semtech.com SC1566 POWER MANAGEMENT Using this figure, and assuming T A(MAX) = 85°C, we can calculate the maximum thermal impedance allowable to maintain T J ≤ 150°C (see page 7): () () W / C 33 R therefore , W / C 0 R and W / C 3 R W / C 36 81 . 1 85 150 P T T R ) MAX )( A S ( TH ) S C ( TH ) MAX )( C J ( TH ) MAX ( D ) MAX ( A ) MAX ( J ) MAX )( A J ( TH ° = ° = ° = ° = − = − = − − − − Applications Information (Cont.) This should be achievable for the TO-263 package using pcb copper area to aid in conducting the heat away from the device, such as a large (~2 squ. inch) pad connected to the tab of the device. Internal ground/power planes and air flow will also assist in removing heat. For higher power dissipations it may be necessary to use a small heatsink and the TO-220 package. Figure 1. Phase-margin Contour Plot 0.001 0.01 0.1 1 10 3A 300mA 30mA 3mA ESR(Ohms) Load Co=2.2uF, Stable Region: Unstable Region: 0.001 0.01 0.1 1 10 3A 300mA 30mA 3mA ESR(Ohms) Load Co=220uF, Stable Region: Unstable Region: 0.001 0.01 0.1 1 10 3A 300mA 30mA 3mA ESR(Ohms) Load Co=22uF, Stable Region: Unstable Region: |
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