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HT46R48AE Datasheet(PDF) 5 Page - Holtek Semiconductor Inc |
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HT46R48AE Datasheet(HTML) 5 Page - Holtek Semiconductor Inc |
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5 / 73 page  Pin Name I/O Configuration Option Description PD0/PWM0 PD1/PWM1 I/O Pull-high I/O or PWM Bidirectional 2-bit input/output port. Software instructions determine if the pin is a CMOS output or Schmitt Trigger input. Configuration option determines if this pin has a pull-high resistor. The PWM output are pin-shared with pins PD0 and PD1 selected via a configuration option. OSC1 OSC2 I O Crystal or RC OSC1, OSC2 are connected to an external RC network or external crystal, determined by configuration option, for the internal system clock. If the RC system clock option is selected, pin OSC2 can be used to measure the sys- tem clock at 1/4 frequency. RES I ¾ Schmitt Trigger reset input. Active low. VDD ¾¾ Positive power supply VSS ¾¾ Negative power supply, ground Note: 1. Each pin on PA can be programmed through a configuration option to have a wake-up function. 2. Individual pins can be selected to have a pull-high resistor. 3. Pins PC2~PC4 and pin PD1/PWM1 exist but are not bonded out on the 24-pin package. 4. Unbonded pins should be setup as outputs or as inputs with pull-high resistors to conserve power. Absolute Maximum Ratings Supply Voltage ...........................VSS -0.3V to VSS+6.0V Storage Temperature ............................ -50°Cto125°C Input Voltage..............................VSS -0.3V to VDD+0.3V Operating Temperature........................... -40°Cto85°C IOL Total ..............................................................150mA IOH Total............................................................ -100mA Total Power Dissipation .....................................500mW Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Ta=25 °C Symbol Parameter Test Conditions Min. Typ. Max. Unit VDD Conditions VDD Operating Voltage ¾ fSYS=4MHz 2.2 ¾ 5.5 V ¾ fSYS=8MHz 3.3 ¾ 5.5 V IDD1 Operating Current (Crystal OSC) 3V No load, fSYS=4MHz ADC disable ¾ 0.6 1.5 mA 5V ¾ 24 mA IDD2 Operating Current (RC OSC) 3V No load, fSYS=4MHz ADC disable ¾ 0.8 1.5 mA 5V ¾ 2.5 4 mA IDD3 Operating Current (Crystal OSC, RC OSC) 5V No load, fSYS=8MHz ADC disable ¾ 48 mA ISTB1 Standby Current (WDT Enabled) 3V No load, system HALT ¾¾ 5 mA 5V ¾¾ 10 mA ISTB2 Standby Current (WDT Disabled) 3V No load, system HALT ¾¾ 1 mA 5V ¾¾ 2 mA VIL1 Input Low Voltage for I/O Ports, TMR and INT ¾¾ 0 ¾ 0.3VDD V VIH1 Input High Voltage for I/O Ports, TMR and INT ¾¾ 0.7VDD ¾ VDD V VIL2 Input Low Voltage (RES) ¾¾ 0 ¾ 0.4VDD V HT46R46E/C46E/R47E/C47E/R48AE/C48AE/R49E Rev. 1.20 5 August 15, 2007 |
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