11

HV256

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline

Doc.# DSFP-HV256

B120406

100-Lead MQFP Package Outline (FG)

20x14mm body, 3.15mm height (max.), 0.65mm pitch, 3.2mm footprint

Symbol

A

A1

A2

b

D

D1

E

E1

e

L

L1

L2

θ

θ1

Dimension

(mm)

MIN

2.50

0.00

2.50

0.22

22.95

19.80

16.95

13.90

0.65

BSC

0.73

1.60

REF

0.25

BSC

NOM

-

-

2.70

-

23.20

20.00

17.20

14.00

0.88

-

-

MAX

3.15

0.25

2.90

0.40

23.45

20.20

17.45

14.20

1.03

JEDEC Registration MS-022, Variation GC-2, Issue B, Dec. 1996.

Drawings not to scale.

1

100

Top View

Seating

Plane

Gauge

Plane

θ

L

L1

L2

View B

View B

θ1

b

e

Side View

A2

A

A1

E

E1

D

D1

Seating

Plane

Note 1

(Index Area

E1/4 x D1/4)

Note 1:

A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier may be either a mold, or an embedded metal or marked feature.