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STTH5L06B-TR Datasheet(PDF) 8 Page - STMicroelectronics |
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STTH5L06B-TR Datasheet(HTML) 8 Page - STMicroelectronics |
8 / 10 page Package information STTH5L06 8/10 Figure 16. DPAK footprint (dimensions in mm) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8. DPAK dimensions Ref. Dimensions Millimeters Inches Min. Max. Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° H L4 G B L2 E B2 D A1 R R C A C2 0.60 MIN. V2 A2 6.7 6.7 3 3 1.6 1.6 2.3 2.3 |
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